Shenzhen HeMeiXin Electronic Co., Ltd

Showing 11 - 15 of 15, total 2 pages [First] [Previous] [Next] [Last]

8l, fr4, enig, gold fingers 1.6mm
Specification: 8L, FR4, ENIG, Gold fingers 1.6mm
Detail: Part Name: D.1635-61 Layer count: 8L Material: FR4 Thickness: 1.60mm Part Size: 137.24* 160/1 up. Copp...

8l, fr4, 1.6mm,blue soldermask
Specification: 8L, FR4, 1.6mm,Blue soldermask
Detail: Part Name: ME-PCB-197-01 Layer count: 8L Material: FR4 Thickness: 1.60mm Part Size: 335* 245/1 up. Cop...

3.2mm,20l blind/burid vias
Specification: 3.2mm,20L blind/burid vias
Detail: layer count£º20L base material£º FR-4 TG170 copper thickness£º all layers 2OZ board thickness£º 3.2mm¡À0.3mm min hole diameter£º 0.50mm(19mil) min trace width£º 0.20mm(8mil) min trace ***cing£º 0.20mm(8mil) suface f...

8l,fr4 2oz,enig, red solder mask
Specification: 8L,FR4 2oz,ENIG, Red solder mask
Detail: Part Name: D.1058-154 Layer count: 8L Material: FR4 Thickness: 1.60mm Part Size: 234* 160/1 up. C...

6l, fr4 tg150, enig 1.6mm
Specification: 6L, FR4 TG150, ENIG 1.6mm
Detail: 1.Part Name: 54463-01 Layer count: 6L Material: FR4 TG150 Thickness: 1.60mm Part Size: 115.8* 135.2/2 up. ...


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